Hi, I’m an electrical engineer in the semiconductor industry, developing process integration solutions and process technologies for manufacturing at the angstrom scale. I enjoy pushing the limits of semiconductor technology to enable advanced technology nodes.

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I received my PhD from the National University of Singapore in 2009 and have since worked across a broad range of semiconductor technologies. My interests lie at the intersection of materials, process technology, and process integration, with a focus on translating materials and process innovations into device and manufacturing solutions.

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Early in my career, I received the Marubun Research Promotion Foundation International Exchange Grant (2006), the TSMC Outstanding Student Research Award, Gold (2007), and the TSMC Internship Program First Prize (2008). My PhD work was further recognized with the IEEE EDS PhD Fellowship (2009) and the European MRS Young Scientist Award (2009).

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In industry, my contributions have been recognized with the GlobalFoundries Invention Achievement Level Awards (2017, 2020), the Best Paper Award at the TEL US Internal Technology Forum (2023), and most recently, the TEL CEO Award (2025).

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I am also passionate about giving back to the IEEE community. From 2016 to 2018, I served as Chair of the IEEE EDS Chapter in Schenectady, NY, during which our chapter was named the 2017 Chapter of the Year. I have also served on the EDS Newsletter Committee (2017–2022) and on the technical program committees for MRS Spring (2017, 2019), IEDM (2020, 2021), EDTM (2024) and ICSICT (2026).

 

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